In order to explore an economical functional phase alternative material for thick film resistors, the crystal structure, microstructure, and electrical properties of (1-x)La0.5Sr0.5Co0.96Ni0.04O3-δ + xLaCo0.4Ni0.58Zn0.02O3 (x = 0.0–1.0) composite ceramics were studied through solid-state reaction experiments. The characterized by x–ray diffraction, scanning electron microscopy, energy dispersiv...

Conductive inks and adhesives were used in the earliest electronics. Thomas Edison was the first to propose conductive adhesives as a way to replace wires all the way back in 1904. Today, adhesives are used with conventional etched copper circuit boards and also with other Polymer Thick Film (PTF) materials to produce electronic products that can be built very efficiently. Safe, reliable and lo...

Integral nickel–phosphorus (NiP) resistors were fabricated on flexible polyimide (PI) substrates by electroless NiP deposition. The deposition process was first set up for standard rigid epoxy substrates and then modified for the flexible substrates. The effects of the PI surface modifications on the interfacial adhesion (NiP/PI) were measured experimentally by the pull-off method. The process ...

We present a technique for patterning thin-film metals (silver and gold) without the need for photolithography. The technique involves microfluidics and can be performed on planar or curved surfaces. Patterns of thin-film metal are fabricated by flowing electroless silver or gold plating solutions through predefined microchannels made of polydimethylsiloxane sealed against a surface of interest...