The phenomenon of dislocation patterning during melt growth of III-V, II-VI and IV-VI semiconductor crystals is discussed. The paper is focused on the formation of cellular structures driven by the growth inherent thermo-mechanical stress. Of particular interest is the scaling of relations between cells size, dislocation density and acting shear stress. Among the materials there are characteris...

A finite different scheme as well as least-square method is presented for the magneto-thermo analysis of an infinite functionally graded hollow cylinder. The radial displacement, mechanical stresses and temperature as well as the electromagnetic stress are investigated along the radial direction of the cylinder. Material properties are assumed to be graded in the radial direction according to a...

A comprehensive computational framework based on the finite element method for the simulation of coupled hygro-thermo-mechanical problems in photovoltaic laminates is herein proposed. While the thermo-mechanical problem takes place in the three-dimensional space of the laminate, moisture diffusion occurs in a two-dimensional domain represented by the polymeric layers and by the vertical channel...

in this study, the analysis of transient thermoelastic response of a functionally graded (fg) non-axisymmetric viscoelastic cylinder is presented. the material properties are assumed to be time- dependent and radially and circumferentially non-homogeneous. the finite element (fe) formulations of the thermoelastic problem are obtained using the virtual work method and all the coupling terms are ...

The formation of a TSV for three-dimensional interconnects using SF6/O2 plasma is explored. Adjusting the O2 gas concentration to 45 sccm, while the SF6 concentration is set to 35 sccm, produced the best combination of chemical and physical etching to provide sidewall angles of 88◦. Three TSV aspect ratios are etched (5/58, 10/100, and 20/100 μm) and subsequently analyzed using the finite eleme...

An updated Lagrangian implicit FEM model for the analysis of large thermo-mechanically coupled hyperelasticviscoplastic deformations of isotropic porous materials is considered. An appropriate framework for constitutive modelling is introduced that includes a stress-free thermally expanded con9guration and a plastically deformed unstressed damaged con9guration. A two-level iterative scheme is e...

An analytical solution is presented for the thermoelastic problem of a half-plane with several cracks under thermo mechanical loading using distributed dislocation technique. The uncoupled quasi-static linear thermoelasticity theory is adopted in which the change in temperature, if any, due to deformations is neglected. The stress field in a half-plane containing thermoelastic dislocation is ob...