Tungsten has been chosen as the main candidate for plasma facing components (PFCs) due to its superior properties under extreme operating conditions in future nuclear fusion reactors such as ITER. One of the serious issues for PFCs is the high heat load during transient events such as ELMs and disruption in the reactor. Recrystallization and grain size growth in PFC materials caused by transien...

BACKGROUND To evaluate the influence of thermal and mechanical fatigue on the shear bond strength of different all-ceramic cores and veneering porcelain interfaces. MATERIAL AND METHODS All-ceramic systems tested were lithium disilicate and zirconia veneered by layering technique. Sixty specimens (n=20) were subjected to shear bond strength. Ten of them were thermal and mechanical cycled. Fra...

1. Introduction The problem of thermal fatigue is frequently encountered in the pipes where two flows with different temperatures mix together. The T-junction is one of the typical components with a considerable potential of thermal fatigue (Chapuliot et al. 2005; Hu & Kazimi 2006; Lee et al. 2009) and is used in many thermohydraulic systems such as combustion engines, turbines, exhaust systems...

on the shear bond strength (SBS) of metallic orthodontic brackets bonded to feldspathic ceramic by a composite resin. Twenty-five ceramic cylinders were etched with 10% hydrofluoric acid for 60 s and received two layers of silane. Brackets were bonded to the cylinders using Transbond XT and assigned to 5 groups (n=5): Group 1 – Control group (without thermal cycling); Group 2 – 500 thermal cycl...

Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area. The use of lead-free solders as thermal interface materials to improve the heat conduction between a chip level device and a heat sink is becoming popular due to their promising thermal and mechanical material properties....

The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove heat away from the device. A compressive loading is usually applied to reduce the interfacial thermal resistance between package and heat sink. In this paper, both experimental approaches and numerical modeling were employed to study the effect of compressive loading ...

Fatigue life, morphological studies, and thermal aging properties of rattan powder-filled natural rubber (NR) composites were investigated as a function of filler loading and a silane coupling agent. NR composites were prepared by the incorporation of rattan powder in the range of 0 to 30 phr into a NR matrix with a laboratory size two roll mill. Thermal aging was carried out for 7 and 14 days ...

A field investigation to examine the fatigue levels in industrial workers working extended (10, 12 and 12.5 h) shifts under significant levels of thermal stress was conducted on 45 male underground miners. Studies were conducted both before and after a major change to the working-in-heat protocol used at the operation. Prior to the change, shortened (6 h) shifts had been used when thermal condi...

Ultra-low coefficient of thermal expansion (CTE) is an elusive property, and narrow temperature ranges of operation and poor mechanical properties limit the use of conventional materials with low CTE. We structured a periodic micro-array of bi-metallic cells to demonstrate ultra-low effective CTE with a wide temperature range. These engineered tunable CTE thin film can be applied to minimize th...