Three different types of carrier techniques have been investigated and developed: thermal release tapes, solvable thermoplastic glue layer and mobile electrostatic carrier. These carriers were applied for manufacture of ultra-thin RFID chips, 12 μm thin CMOS image sensors and to a new process sequence that enables the formation of solder balls at the front side of an already thinned device wafe...

Modification of lattice thermal conductivity (κL) of a solid by means of hydrostatic pressure (P) has been a crucially interesting approach that targets a broad range of advanced materials from thermoelectrics and thermal insulators to minerals in mantle. Although it is well documented knowledge that thermal conductivity of bulk materials normally increase upon hydrostatic pressure, such positi...

We investigated the thermal performance of a power semiconductor module used in mobile communication systems. The module contained hetero-junction bipolar transistor (HBT) fingers, which were fabricated on the top of a semiconductor substrate. We calculated the thermal resistance between the HBT fingers and the bottom surface of a multi-layer printed circuit board (PCB) using a finite element m...

Mention Tape Ball Grid Array (TBGA) and the first thing comes to mind is the high cost. In fact, most end users rightfully associate TBGA with the less commonly practiced assembly processes such as Tape Automated Bonding (TAB) and expensive gold bump process. This impression of TBGA repels end users and limits TBGA to mostly high end applications and a very narrow spectrum of lead counts. Times...

A network identification by deconvolution (NID) method is applied to the thermal transient response of packaged and unpackaged microcoolers. A thin film resistor on top of the device is used as the heat source and the temperature sensor. The package and the bonding thermal resistances can be easily identified by comparing structure functions. High-speed coplanar probes are used to achieve a sho...

The effects of different bonding parameters, such as temperature, pressure, curing time, bonding temperature ramp and post-processing, on the electrical performance and the adhesive strengths of anisotropic conductive film (ACF) interconnection are investigated. The test results show that the contact resistances change slightly, but the adhesive strengths increase with the bonding temperature i...