A microscopic investigation has been made on the shearing of one leaded and two leadfree solders by using an in situ SEM method. A shear lap joint specimen is designed and fabricated to accommodate a thin layer of solder alloy between copper strips. A non-contact method that measures strains in a very narrow area in the solder was applied. A laser grid was also used on the copper strip for meas...

An optical solder joint inspection system(0SIIS) has been developed for the automatic visual inspection of soldered parts on the printed circuit boards. Its advantages over existing techniques include the detection of 3-0 shape of specular objects with high reliable and high speed. In this paper, we will propose a solder joint inspection scheme for a prototype of the OUIS. The inspection scheme...

This paper will discuss the solder joint reliability aspects of a new wafer level Chip Scale Package (CSP) form factor. The CSP requires no leadframe or interposer tooling. It is the same size as the die, and was originally developed for low-pin count analog devices for pitches from 0.8 mm down to 0.5 mm. The package has been demonstrated with eutectic solder bumps on 8-lead devices. The form f...

In this paper, various mass fractions (0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) of silicon carbide nanowires (SiC NWs) were incorporated into pure Sn solder to enhance the performances joint. The wetting behavior, shear strength, and intermetallic compound (IMC) growth mechanism Sn–xSiC/Cu during solid–liquid diffusion at 250 °C investigated systematically. experimental results demonstrated that wettabi...

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint re...

To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints in room temperature. The mechanical low cycle fatigue tests were performed under several loading angles. The loading angle is controlled by several g...

In this study, the characteristics of a photovoltaic (PV) ribbon (t = 0.25 mm) joint with 60Sn40Pb and 62Sn2Ag36Pb solders were evaluated using thermal shock tests. The thermal shock tests were performed under three conditions: −40–65 ◦C, −40–85 ◦C, and −40–105 ◦C. The results of these tests were analyzed using electroluminescence (EL) and cross-sectional images. Following testing, broken metal...