In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. Based on the dislocation controlled creep mechanism and Gibbs’ free-energy theory, a new creep constitutive model was proposed. The model was found to describe accurately the creep flow of the solder and to b...

Reliability of QFP (quad flat package) solder joints after thermal shock was investigated for PCB’s and connecting leads plated with several different alloy coatings before soldering. Sn–8 wt%Zn–3 wt%Bi (hereafter, Sn–8Zn–3Bi) was selected as a solder, and FR-4 PCB’s finished with Cu/Sn, Cu/OSP and Cu/Ni/Au were used as substrates. The leads of the QFP were Cu plated with Sn–10 wt%Pb, or Sn, or...

Background: Different soldering techniques have a variety of applications in dentistry. One of the most important uses of soldering is to join multiple-unit fixed partial dentures together. In this Study, two base metal alloys (Supercast and Minalux) were soldered  and their tensile, compressive and flexural strengths were measured and compared to each other. Materials and methods: In this ...

It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties next-generation electronics, can be accelerated through a fundamental understanding phase transformation microstructure control in joints. Advanced characterization techniques including synchrotron radiation provide comprehensive toolset to measure the composition, crystallo...

Soldering is one of the oldest and most successful manufacturing technologies in use today-boasting a 5,000 year history and an immense database.’ Ancient artisans perfected the use of precious metal hard solders, but Roman engineers optimized the use of soft solders for practical industrial use. Tin-lead (SnPb) solders were used to join lead sheets that lined the magnificent aqueducts.2 Low-te...

Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper “san...