Articles you may be interested in Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure Appl. Investigation of void nucleation and propagation during electromigration of flip-chip solder jo...

This study compared fabr/cation of silver solder joints by dental students using an orthodontic blowpipe .or a Hydroflame ® soldering unit. Fifty-eight students attended a lecture and observed demonstrations of silver solder/ng. Thirty students used a Hydroflame ® to prepare one practice solder joint and two technique solder joints. These students then prepared one practice solder joint and two...

In this study, we have investigated the effect of thermal aging on impact strength of Sn-Ag-Cu solder bumps in fluxless soldering process using formic acid atmosphere. We conducted impact tests on as-reflowed and thermally-aged solder bumps, which were fabricated on either formic acid atmosphere or a liquid flux. The results indicated that the morphology of the intermetallic compound layers in ...

Low-cycle, lap-shear fatigue behavior of Sn-based, Pb-free solder alloys, Sn3.5Ag, Sn-3.5Ag-Cu, Sn-3.5Ag-Bi, and Sn-0.7Cu, were studied at room temperature using specimens with printed circuit board (PCB)/solder/PCB structure under total displacement of ±10 μm, 12 μm, 15 μm, and 20 μm. The fatigue lives of various solder joint materials, defined as 50% load drop, were correlated with the fractu...

Copper wires have been attracting much attention for Large Scale Integration (LSI) bonding because of their excellent mechanical and electrical properties, in addition to their low material cost. The ends of these wires are usually joined to pads or through-holes on a printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the deformation resistance of solder...

The near eutectic 60%-40Pb alloy is the most commonly used solder for electrical interconnections in electronic packages. This alloy has a number of processing advantages (suitable melting point of 183°C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and fail...

Sn–Ag–Cu composite solders reinforced with nano-sized, nonreacting, noncoarsening 1 wt% TiO2 particles were prepared by mechanically dispersing TiO2 nano-particles into Sn–Ag–Cu solder powder and the interfacial morphology of the solder and flexible BGA substrates were characterized metallographically. At their interfaces, different types of scallop-shaped intermetallic compound layers such as ...

To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints in room temperature. The mechanical low cycle fatigue tests were performed under several loading angles. The loading angle is controlled by several g...

Vibration fatigue test and analysis methodology for flip chip solder joint fatigue life assessment have been developed by performing vibration tests with constant G-level and varying G-level input excitation. The linear cumulative damage analysis method (Miner’s rule) predicts non-conservative result for vibration fatigue life of flip chip solder joint. Finite element analysis (FEA) using a glo...

Creep strain is probably the most important time-dependent damage accrual factor affecting solder joint reliability. Under typical multi-hour loading conditions, creep-induced strain is a complex time per cycle, the system. function of solder metallurgical structure, solder temperature, loading applied stress, and the spring constant of the combined part/lead/board The complex system level cree...