Biocompatible polymers utilized for flexible encapsulations of implantable microsystems provide many advantages compared to widely used rigid titanium or ceramic packages. However, polymers alter their properties due to interactions with their environment, but especially for longterm implants, a reliable protective function of these materials is required. To investigate the protective function ...

This paper presents a complete low-voltage 3V single supply analog lock-in amplifier (LIA) based on phase sensitive detection technique (PSD) for processing AC sensor signals buried in noise in embedded wireless applications. Reference and bias sensor signals are provided by a quadrature oscillator. Experimental results confirm the capability of the proposed lock-in amplifier to effectively rec...

The resistive-capacitive behavior of long interconnects which are driven by CMOS gates is analyzed in this paper. The analysis is based on the π-model of an RC load and is developed for submicron devices. Accurate and analytical expressions for the output voltage waveform, the propagation delay and the short circuit power dissipation are derived by solving the system of differential equations w...

Porous dielectrics such as SiCOH are used as the insulator in interconnect wiring in microelectronics devices to lower the dielectric constant and therefore decrease the resistive–capacitive delay. After etching a trench in low-k dielectrics in fluorocarbon plasmas, a CFx polymer remains on the sidewalls, which must be removed in a manner that does not damage the low-k material. This can be acc...

Short, medium, and long on-chip interconnections having linewidths of 0.45–52 m are analyzed in a five-metallayer structure. We study capacitive coupling for short lines, inductive coupling for medium-length lines, inductance and resistance of the current return path in the power buses, and line resistive losses for the global wiring. Design guidelines and technology changes are proposed to ach...

Current-mode signaling significantly increases the bandwidth of on-chip interconnects compared to voltage mode signaling and reduces the overall propagation delay. A delay formula for current mode is necessary for estimation of delay and bandwidth for VLSI systems. In this paper, closed-form expression of delay model based on the effective lumped element resistance and capacitance approximation...

Large attention has recently been given to a novel technology named memristor, for having the potential of becoming the new electronic device standard. Yet, its manifestation as the fourth missing element is rather controversial among scientists. Here we demonstrate that TiO2-based metal-insulator-metal devices are more than just a memory-resistor. They possess resistive, capacitive and inducti...

 Charge transfer has been demonstrated to be a cost-effective method to measure capacitive sensors with low-end microcontrollers. Here we apply charge transfer to measure the output of voltage dividers that include a highvalue resistive sensor hence extending the advantages of this method to a large group of sensors. By using two-point calibration, the maximal deviation obtained, referred to t...

 This paper presents an application of an adapted (R-L-M-C) PEEC method dedicated to the extraction of equivalent circuit of power electronics devices. Two dedicated integral methods with different meshes are used to compute either resistive and inductive elements or capacitive couplings. The adaptive multi-level fast multipole method (AMLFMM) is presented to extract parasitic capacitances on ...