نتایج جستجو برای: redundant shearing strain

تعداد نتایج: 247671  

Journal: :Journal of the Royal Society, Interface 2015
Yue Wang Xiangming Li Hongmiao Tian Hong Hu Yu Tian Jinyou Shao Yucheng Ding

Dry adhesion observed in the feet of various small creatures has attracted considerable attention owing to the unique advantages such as self-cleaning, adaptability to rough surfaces along with repeatable and reversible adhesiveness. Among these advantages, for practical applications, proper detachability is critical for dry adhesives with artificial microstructures. In this study, we present a...

Journal: :Journal of materials research and technology 2021

Abstract The rheological properties of cement pastes prepared using kenaf-plant cellulose microfibers (CMFs), which was incorporated for the purpose internal curing, were investigated. main test variables are length and mass fraction CMFs. CMFs lengths 400 ?m 5 mm included in mixtures at 0.3, 0.6, 1, 2 wt.% cement. Dry CMF particles wetted with water to fiber saturation point vacuum filtration ...

Journal: :Journal of Nepal Geological Society 2023

The outer Lesser Himalaya in eastern Nepal has gone through intense ductile shearing and recrystallization due to the emplacement of Higher Himalayan thrust sheet. It resulted formation various microstructures footwall rocks Himalaya. Present study focuses on quartz grain shear sense indicators metasedimentary interpret deformation characteristics area. Thin sections were prepared from oriented...

Journal: :Microelectronics Reliability 2012
Sebastien Jacques A. Caldeira N. Batut A. Schellmanns R. Leroy L. Gonthier

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.08.017 ⇑ Corresponding author at: STMicroelectronics, 16 7155, 37071 Tours Cedex 2, France. Tel.: +33 (0)2 47 01 34. E-mail address: [email protected] (S. Jacqu In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the fo...

2007
C. E. Carlton P. J. Ferreira

An inverse Hall–Petch effect has been observed for nanocrystalline materials by a large number of researchers. This effect implies that nanocrystalline materials get softer as grain size is reduced below a critical value. Postulated explanations for this behavior include dislocation-based models, diffusion-based models, grain-boundary-shearing models and two-phase-based models. In this paper, w...

Journal: :journal of agricultural science and technology 2010
r. tabatabaee koloor a. m. borgheie

in order to help in the engineering design of rice harvesting machines, there is a need to have exact information concerning the physical and mechanical properties of rice stems. the cutting force for rice stems, therefore, was measured by designing and fabricating a static and dynamic shear test apparatus. the effects of moisture levels and the cross-sectional area of stem as well as the varie...

1972
R. HILL J. R. RICE

A GENERAL time-independent constitutive framework is constructed for crystals capable of crystallographic shearing. No restrictions are placed on their elasticity or on the amounts of slip. In deriving properly-objective relations due account is taken of the separate motions of the material and lattice. A precise specification of the structure of the flow rule leads to conditions for the existe...

Journal: :Molecules 2017
Jianfeng Yu

Cell disruption is an important step during the extraction of C-phycocyanin from Spirulina platensis. An ultrafine shearing method is introduced and combined with soaking and ultrasonication to disrupt the cell walls of S. platensis efficiently and economically. Five kinds of cell disruption method, including soaking, ultrasonication, freezing-thawing, soaking-ultrafine shearing and soaking-ult...

Journal: :IJMMME 2011
Amrita Priyadarshini Surjya K. Pal Arun K. Samantaray

This paper deals with the plane strain 2D Finite Element (FE) modeling of segmented, as well as continuous chip formation while machining AISI 4340 with a negative rake carbide tool. The main objective is to simulate both the continuous and segmented chips from the same FE model based on FE code ABAQUS/Explicit. Both the adiabatic and coupled temperature displacement analysis have been performe...

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