Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...

Similarities and differences between photonic and microelectronic integration technology are discussed and a vision of the development of photonic integration in the coming decade

Metal—Polyaniline nanocomposites such as Platinum-Polyaniline nanocomposite is prepared by insitu oxidative polymerization of aniline and reduction of Pt+4 ions into Pt nanoparticles. Thepolymerization of aniline was carried out in the presence of 1(2PtCN6 [Potassium Hexa CyanoPlatinate (IV)] as oxidizing agent. During the reaction aniline monomers undergo oxidation andform polyaniline (PANT) w...

The use of thick films becomes more and more important in particular for electronic and microelectronic applications. The term “thick film” does not relate so much to the thickness of the film but more to the kind of deposition. Thick films are made by low-priced processes such as doctor (dr) blading, screen-printing, or spraying methods, etc. The preparation of thick films of ceramic material ...

Rapid continuous thermal control of chemical reactions such as those for chemical vapor deposition (CVD) growth of nanotubes and nanowires cannot be studied using traditional reactors such as tube furnaces, which have large thermal masses. We present the design, modeling, and verification of a simple, low-cost reactor based on resistive heating of a suspended silicon platform. This system achie...