A comprehensive kinetic analysis was established to investigate the electromigration (EM) enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free solder joints with Cu under bump metallization (UBM). The kinetic model takes into account Cu–Sn interdiffusion and current stressing. Derivation of the diffusion coefficients and the effective charge numbers for the inter...

An etch resistance phase was found in dental silver amalgam when the amalgam was examined metallographically. This phase was common to the silver alloy ingot as well as to its prepared amalgam. Qualitative electron microprobe technics were used to identify this phase. Quantitative electron microprobe analysis defined it as the R' phase of the copper-tin system or the intermetallic compound Cu6Sn5.

Rare-earth-free permanent-magnets have gained immense focus in the view point of mitigating the critical-material aspects of rare-earth elements. The intermetallic compound Zr2Co11 is a promising candidate. Polymorphism exists in the Zr2Co11 compound; a high-temperature phase has a rhombohedral structure and a low temperature phase has an orthorhombic structure [1,2]. Both of the two phases in ...

We investigate the catalytic property of the intermetallic compound Pt3Ti by studying the interaction of its (111) surface with hydrogen. Based on density functional theory, we obtain the 2–D PES to estimate the barrier for H2 dissociation, and the binding energy of H atom at diŠerent sites of the substrate. The observed energetics can be explained in terms of the role played by the Ti atoms in...