نتایج جستجو برای: comsol

تعداد نتایج: 1877  

Journal: :Advances in Electrical and Electronic Engineering 2018

Journal: :AIP Advances 2023

Micromagnetic simulation is a numerical method to solve the Landau–Lifshitz–Gilbert (LLG) equation for magnetic dynamics. Most of mainstream micromagnetic packages, including object oriented framework and MuMax3, perform in time domain. Here, utilizing frequency domain capability COMSOL Multiphysics, we developed COMSOL-based module that solves LLG domain, which runs much faster more accurate t...

Journal: :IOP Conference Series: Materials Science and Engineering 2019

2016
M. Nickaeen I. L. Novak A. Mogilner B. M. Slepchenko

Modeling of migrating cells often requires sophisticated numerical tools necessary for solving highly nonlinear partial and ordinary differential equations in domains with moving boundaries. We have recently developed a novel conservative method [1] for simulating reactions and transport in moving domains, which combines an Eulerian approach with tracking an explicit boundary. The latter is imp...

2015
N. P. Uth J. Mueller B. Smucker A. Yousefi

Introduction: Bone tissue has a limited ability for regeneration; critically sized defects cannot self-heal and require medical intervention. Bone tissue engineering (TE) circumvents this issue by growing replacement bone tissue from the patient's own cells inside scaffolds. TE scaffolds are porous constructs that act as a support structure during bone regeneration and helps cells attach and pr...

2009
Dominic Carrier Jan J. Dubowski

We present a Finite Element Method simulation procedure that allows rapid development of prototype devices comprising novel self-referenced interference SPR (surface plasmon resonance) biosensing microstructures. The procedure takes advantage of commercial Comsol Multiphysics and Matlab software and their bi-directional link.

2012
Srinivasa Rao P. Sri Sairam

In this paper, we have design MEMS module based on thermal expansion using COMSOL Multiphysics. This device thermally expands when it is subjected to temperature. Beryllium copper alloy is used as material for this device. The expansion is measured in-terms of displacement.

2016
Vikas Poonam Beniwal

A MEMS thermal actuator is a micromechanical device that typically generates motion by thermal expansion. In this paper we have studied the thermal expansion of different shapes of thermal actuator and implemented using COMSOL tool.Different shapes are designed and analyzed.Rectangular, triangular and U shaped actuator is designed and implemented.

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