Anbarzadeh, A.
[ 1 ] - Atomic diffusion modeling and Investigation of joining properties of TLP in AA2024 to AA6061 alloys
In this study, to bond AA2024 and AA6061 alloys to each other, three elements (Sn, Zn and Ga) were considered as interlayer elements in terms of atomic diffusion depth in the base metal and storage at 453°C for 2 days, 10 hours, 210 minutes, and 30 seconds that they were examined for atomic diffusion modeling. Finally, the two alloys were connected at a temperature of 453°C in a furnace enviro...
[ 2 ] - Atomic diffusion modeling and Investigation of joining properties of TLP in AA2024 to AA6061 alloys
In this study, to bond AA2024 and AA6061 alloys to each other, three elements (Sn, Zn and Ga) were considered as interlayer elements in terms of atomic diffusion depth in the base metal and storage at 453°C for 2 days, 10 hours, 210 minutes, and 30 seconds that they were examined for atomic diffusion modeling. Finally, the two alloys were connected at a temperature of 453°C in a furnace enviro...
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