موحدی, مجتبی
دانشگاه صنعتی شریف
[ 1 ] - The effect of rotation speed to traverse speed ratio and number of welding passes on thermo-mechanical stability of severely plastic deformed aluminum joined by friction stir welding and graphite/Al2O3 hybrid powder
In this study, thermo-mechanical stability of two-pass constrained groove pressing (CGP) AA1050 sheets towards friction stir welding (FSW) employing hybrid powder (%50vol. micrometric graphite powder+%50vol. α-Al2O3 nanoparticles) was investigated by examining its microstructural evolutions and mechanical properties. FSW was carried out via different process variables in order to reach the high...
[ 2 ] - Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...
[ 3 ] - The effect of rotation speed to traverse speed ratio and number of welding passes on thermo-mechanical stability of severely plastic deformed aluminum joined by friction stir welding and graphite/Al2O3 hybrid powder
In this study, thermo-mechanical stability of two-pass constrained groove pressing (CGP) AA1050 sheets towards friction stir welding (FSW) employing hybrid powder (%50vol. micrometric graphite powder+%50vol. α-Al2O3 nanoparticles) was investigated by examining its microstructural evolutions and mechanical properties. FSW was carried out via different process variables in order to reach the high...
[ 4 ] - Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...
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