بررسی اثر زمان و دمای تبخیر حلال دو نوع ادهزیوتوتال اچ بر استحکام باند ریزکششی کامپوزیت به عاج

Introduction: Effect of drying time and temperature of solvent evaporation were different in different studies. Therefore, the aim of this study was to investigate the appropriate drying temperature and time of solvent evaporation in the two adhesives of Etch and Rinse. Methods: Seventy-two sound third molars were collected. On the buccal surface of the crown, flat dentinal surfaces were created and bonded with two step Etch and Rinse adhesives: Adper single bond2 (ethanol/water-based) and Prime and Bond2.1 (acetone-based). Solvents were evaporated for 2s, 5s or 10s at either 21℃ or 37℃ prior to light activation (10s) and composite buildups were constructed incrementally. After storage in 37℃ water for 24 hours, the specimens were prepared for microtensile bond strength and were tested at 1 mm/min crosshead speed. Moreover, the study data were analyzed via T-test as well as one-way ANOVA and three-way ANOVA. Results: The Prime and Bond2.01 group had significantly higher bond strength compared to Adper single bond group (p=0.00). The temperature of solvent evaporation from 2s to 5s in Prime and Bond 2.01 demonstrated upper results. Temperature of solvent evaporation did not affect the microtensile bond strength of both adhesive. Conclusion: Temperature of air for evaporation of solvent did not affect microtensile bond strength. In addition, the study results indicated that the effect of time in two groups was different.