Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging

Gold-coated silver wire was developed to alleviate the high cost of Au used in semiconductor packaging. Ball-bonding and stitch-bonding techniques were fabricate dummy packaging material, comprising 97.3 % Ag, 97.3% Au-Coated 99.99 %Au wires. The ball shear test (BST), pull (BPT), microstructural attributes ultrasonic bonding interfaces compared with initial properties, both before after highly accelerated stress (HAST), conducted at 130 ? 85% relative humidity (RH). strength for all variants ?23~24 gf. Following HAST, Ag wire, Au-coated decreased by approximately 75 %, 47 17 respectively. microstructure analysis revealed that cracks propagated ends interface Au-rich Au-Al intermetallic compound (IMC) inhibited propagation crack ACA/Au interface. Additionally, it discovered presence Ag-Au-Al IMC ACA reduced Kirkendall voids, which act as a barrier interdiffusion.