Towards flexible asymmetric MSM structures using Si microwires through contact printing

Contact Transfer Printing: Contact Transfer Printing of Side Edge Prefunctionalized Nanoplasmonic Arrays for Flexible microRNA Biosensor (Adv. Sci. 9/2015)

Contact Formation on P-doped Si by Screen-printing Pure Ag Pastes for Bifacial N-type Si Solar Cells

n-type solar cell concepts increasingly utilize emitter formation by diffusion from boron doped sources. Combining the advantage of n-type silicon material and bifacial cell architecture enables high-efficiency and versatile photovoltaics. In case of boron emitters, it was standard until now to form a metal-semiconductor contact by screenprinting Al containing Ag pastes. Instead of utilizing Al...

Fabricating microarrays of functional proteins using affinity contact printing.

Supporting Information Proteins were from Sigma and used as received. Antibodies were labelled either with tetramethylrhodamine isothiocyanate (TRITC) or fluorescein isothiocyanate (FITC). Solutions of proteins and adsorption experiments were done in PBS or in PBS-containing 1% BSA. Bis(sulfosuccinimidyl)suberate (BS 3) was from Pierce, aminopropyltriethoxysilane (APTS) from Fluka. PDMS stamps ...

Stable, flexible, peephole pretty-printing

Programmers working on large software systems are faced with an extremely complex, information-rich environment. To help navigate through this, modern development environments allow flexible, multi-window browsing and exploration of the source code. Our focus in this paper is on pretty-printing algorithms that can display source code in useful, appealing ways in a variety of styles. Our algorit...

Integration of inverted InGaAs MSM array on Si substrate through low temperature wafer bonding

An array of inverted InGaAs metal–semiconductor–metal (MSM) photodetectors has been integrated into a silicon substrate using a low temperature In–Au wafer bonding technique. The total thickness of the bonding metal layers is less than 1 mm. It is shown that the photocurrent of the back illuminated InGaAs MSM photodetectors after bonding increases by 70% compared to the front illuminated MSM me...