Study on STI planarization process using fixed abrasive tool (1st Report)
نویسندگان
چکیده
منابع مشابه
Modeling of Advanced Integrated Circuit Planarization Processes: Electrochemical-Mechanical Planarization (eCMP), STI CMP using Non-Conventional Slurries
Progression of technology nodes in integrated circuit design is only possible if there are sustainable, cost-efficient processes by which these designs can be implemented. As future technologies are increasing device density, shrinking device dimensions, and employing novel structures, semiconductor processing must also advance to effectively and efficiently process these devices. Arguably one ...
متن کاملA Fixed Abrasive CMP Model
Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in both front-end (STI) and back-end (ILD) integrated circuit manufacturing. Conventional CMP processes utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. More recent work has examined the use of a fixed abrasive CMP pad [1], in which abrasive material is embedded...
متن کاملInvestigation on Process Parameters of Ball Screw Finishing Using Magnetic Abrasive Field
Surface finishing is one of the most significant steps in industries which are engaged with surface quality. Finishing by magnetic field is a new method of surface finishing. In this process, machining is executed in mechanical way and semi-homogeneous abrasive slurry performs finishing of surfaces. Needed force to grind surfaces is made by magnetic field. Therefor this method is considered as ...
متن کاملStudy of Traverse Grinding Process (1st Report) Accumulation Phenomenon and Size Generation Mechanism in Traverse Grinding
plicated processes on the wheel surf ace along the wheel width. In order to make these processes clear, the experimental analysis of traverse grinding was conducted by widely changing the speed ratio, Kv, the setting depth of wheel, ‡TMT, and the number of total steps, m, (the ratio of the wheel width over the traverse feed per one revolution of the workpiece). The following results were obtain...
متن کاملExperimental Study on Slicing of Sapphire with Fixed Abrasive Diamond Wire Saw
Experimental study on slicing of sapphire with fixed abrasive diamond wire saw was conducted in this paper. The process parameters were optimized through orthogonal experiment of three factors and four levels. The effects of wire speed, feed speed and tension pressure on the surface roughness were analyzed. Surface roughness in cutting direction and feed direction were both detected. The result...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering, Contributed Papers
سال: 2004
ISSN: 1881-8722,1348-8724
DOI: 10.2493/jspe.70.128