Simulation of SiP Solder Joint Geometry and Random Vibration Reliability Prediction
نویسندگان
چکیده
منابع مشابه
Solder Joint Reliability Analysis and Testing
QFN packages have become mainstream designs for mobile applications. As more applications adopt the QFN style packages, I/O count requirements are increasing. The typical method for increasing pin count in a QFN package is to increase the body size to accommodate the additional lead fingers. This is undesirable though, as mobile device users are pushing for smaller package sizes. By using a dua...
متن کاملStudy of micro-BGA solder joint reliability
A new re¯ow parameter, heating factor (Q g), which is de®ned as the integral of the measured temperature over the dwell time above liquidus, has been proposed in this report. It can suitably represent the combined eect of both temperature and time in usual re¯ow process. Relationship between reliability of the micro-ball grid array (micro-BGA) package and heating factor has been discussed. The...
متن کاملStacked solder bumping technology for improved solder joint reliability
Reliability in flip chip and Ball Grid Array is a major concern. Solder joint geometry is extremely important from a reliability point of view. Commonly, the flip chip solder bump takes on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that the hourglass-shaped solder bumps experience the lowest plastic strain and have the longest lifetime. In...
متن کاملPrognostics of Solder Joint Reliability under Vibration Loading Using Physics of Failure Approach
Title of Document: PROGNOSTICS OF SOLDER JOINT RELIABILITY UNDER VIBRATION LOADING USING PHYSICS OF FAILURE APPROACH Jie Gu, Doctor of Philosophy (Ph.D.), 2009 Directed By: Chair Professor and Director, Michael G. Pecht, Department of Mechanical Engineering Physics-of-failure (PoF) is an approach that utilizes knowledge of a product’s life cycle loading and failure mechanisms to perform reliabi...
متن کاملCree XLamp LEDs Solder Joint Reliability Study
Copyright © 2013-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. ENERGY STAR® is a registered trademark of the U.S. Environmental Protection Agency. Other trademarks, product, and company names are the property of their respective owners and do not...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Jixie gongcheng xuebao
سال: 2022
ISSN: ['0577-6686']
DOI: https://doi.org/10.3901/jme.2022.02.276