Multi-Chip and Bare Chip Packaging Technologies. Bare-Chip Technology Using Anisotropic Conductive Films.

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Due to increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in electronic devices, extensive studies on flexible electronic packages have been carried out. However, there has been little research on flexible packages by wafer level package (WLP) technology using anisotropic conductive films (ACFs) and flex substrates, an innovative packaging technology...

Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)

Chip-on-film (COF) technology has been developed for liquid crystal displays (LCD) due to its high yield capability in fine pitch products. In this study, a new COF thermosonic (TS) bonding process using anisotropic conductive adhesive and ultrasonic vibrations will be introduced. Si chips with 16 cylindrical Cu bumps (¤100μm) and polyimide (PI) film substrate with a thickness of 70 μm were pre...

Chip-to-chip interconnect integration technologies

With continuous increase in the off-chip bandwidth requirements, conventional interconnection methodologies are quickly becoming incapable of meeting the demand. Recent progress in silicon interposer and 3D integration technologies seek to alleviate some of these bottlenecks. This paper reviews the evolution of conventional interconnect methodologies and recent progress in platforms allowing hi...

Characteristic study of anisotropic-conductive film for chip-on-film packaging

A Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging using Electroless Nickel Gold Bumping

Flip Chip (FC) Technology is gaining an increased level of importance for a variety of applications based on Flip Chip on Board or Flip Chip in Package. The first driving force for the introduction of this Technology was the need to achieve increased speed and performance along with higher I/O count. A breakthrough, however, will be the use of flip chip due to cost reduction. For this aim it is...