Mitigation of Thermal Stability Concerns in FinFET Devices

Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis the and device levels, to allow observation alerting of chip temperature reliability risks. novel algorithm reducing measurement noise by means fluctuation compensation filtering invalid data is presented demonstrated The results this work show that proposed techniques make exceptional improvements sensory accuracy. Using methodology enables mitigation concerns systems, including large servers, accelerates development smart resource allocation formations.