In-Process Measurement of Three-Dimensional Deformations Based on Speckle Photography

In the concept of process signature, relationship between a material load and modification remaining in workpiece is used to better understand optimize manufacturing processes. The basic prerequisite for this be able measure loads occurring during machining form mechanical deformations. Speckle photography suitable in-process measurement task already variety ways in-plane deformation measurements. shortcoming fast robust technique based on image correlation techniques that out-of-plane deformations direction system cannot detected increases error paper, we investigate method infers local motions surface from decorrelation speckle patterns thus reconstruct three-dimensional fields. implementation evaluation enables reconstruction 3D fields, so capability remains given. First measurements deep rolling show dynamic underneath die can captured demonstrate suitability analysis.