Enhanced Thermal Transport across Self‐Interfacing van der Waals Contacts in Flexible Thermal Devices

Minimizing the thermal contact resistance (TCR) at boundary between two bodies in is critical diverse transport devices. Conventional methods have several limitations, such as high TCR, low interfacial adhesion, a requirement for external pressure, and optical transparency. Here, self-interfacing flexible device (STD) that can form robust van der Waals mechanical low-resistant to planar non-planar substrates without need pressure or surface modification presented. The based on distinctive integration of bioinspired adhesive architecture layer formed from percolating silver nanowire (AgNW) networks. proposed exhibits strong attachment (maximum 538.9 kPa) target while facilitating across interface with TCR (0.012 m2 K kW−1) use materials, chemistries.