Creep Fracture of Copper Tricrystal along Grain Boundaries

نویسندگان

چکیده

The major objective of the present study was to investigate creep fracture process a copper tricrystal having 〈110〉-tilt Σ3, 3, 9 grain boundaries. Creep tests at 0.81 TM (TM: melting temperature on absolute scale) under 4 MPa tensile stress were carried out for three samples prepared from same tricrystal. Grain-boundary sliding occurred along only Σ9 boundary, and triple junction boundaries completely suppressed sliding. in different stages deformation. initiated by sliding-induced voids boundary. damage void formation developed into complete separation boundary crack induced surface grooves one Σ3 boundaries, arranged almost perpendicular axis. propagation resulted final cavities suggested that ductile manner after neighboring grains partly separated

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ژورنال

عنوان ژورنال: Materials transactions

سال: 2022

ISSN: ['1345-9678', '1347-5320']

DOI: https://doi.org/10.2320/matertrans.mt-m2022066