Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
نویسندگان
چکیده
منابع مشابه
The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIGplated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad sur...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2005
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.46.2730